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学术报告(2019年1月7日 周一 9:00-12:00)

报告人: 
王烁道教授 (俄克拉荷马州立大学)
题目: 
In-Plane Deformation Mechanics for Highly Stretchable Electronics
地点: 
南校园十友堂300
时间: 
2019年1月7日 周一 9:00-12:00

主持人:朱文鹏 教授

欢迎广大师生前来交流!

 

【摘要】

Stretchable electronics represents a relatively recent class of technology of interest partly due to its potential for applications in sensory robotic skins, wearable communication devices, skin-mounted monitors of physiological health, and bio-inspired smart systems.

A key challenge in each of these systems is in the development of strategies in mechanics that simultaneously allow large levels of elastic stretchability and high areal coverages of active devices built with materials that are themselves not stretchable (e.g., inorganic semiconductors). Majority of existing structure designs for stretchable interconnects, including a broad variety of shapes, sizes, and geometric arrangements, are ultra-thin structures that exploit out-of-plane buckling for stretchability. One critical limitation is that interconnects/antennas thin geometries have non-negligible electrical resistances and high levels of power dissipation.

This presentation introduces a different route to stretchable structures in which thick bar geometries replace thin ribbon layouts to yield scissor-like deformations instead of in- or out-of-plane buckling modes. Experiments and analytic/computational models show that metal and silicon structures with this thick-bar configuration can stretch to strains as large as 350% and 90%, respectively, without fracture. Metal features with these layouts have the additional advantage that they offer low resistance as interconnects for enhanced operation in examples that include arrays of high-power LEDs, solar cells, and radio frequency antenna platforms.

 

【个人简介】

Shuodao Wang received the B.S. degree in engineering mechanics from Tsinghua University, Beijing, China, in 2007, and the Ph.D. degree in mechanical engineering from Northwestern University, Evanston, IL, USA, in 2012. He was a Post-doctoral Research Associate with the Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL, USA, from 2012 to 2014. In 2014, he joined the School of Mechanical and Aerospace Engineering, Oklahoma State University, Stillwater, OK, USA, as an Assistant Professor. His research interests are in solid mechanics, mechanics of innovative forms of  stretchable and flexible micro electronics, bio-materials, bio-inspired and bio-mimicking systems.